Application:
It is suitable for packaging of electronic products with moisture-proof requirements: all kinds of PC board, IC integrated circuit, optical drive, hard disk, as well as the vacuum packaging of chemical raw materials and biological intermediates, etc., surface resistance value 10^8-10^10Ω.
Construction:
| Total Thickness (μm) | 100±10% μm (including glue water） |
150±10% μm (including glue water） |
||
| Structure layers (from outside to inside) |
Material |
Thickness of each layer |
Material |
Thickness of each layer |
| 1st layer | ESD+PET | 12μm | ESD+PET | 12μm |
| 2nd layer | AL | 7μm | AL | 7μm |
| 3rd layer | PA (Nylon) | 15μm | PA (Nylon) | 15μm |
| 4th layer | ESD+LDPE | 65μm | ESD+LDPE | 110μm |
